|
hydrothermal
|
-morphology
control |
-long reaction times |
| -environmentally friendly |
-high-pressure requirements |
| -low-cost |
-limited scalability |
| -suitable for diverse nanomaterials |
|
|
solvothermal
|
-solvent tunability |
-toxicity solvents |
| -complex structure setup formation |
-flammability risk |
|
electrodeposition
|
-ambient condition synthesis |
-requires
precise control of potential/current |
| -low-cost
system |
-requires conductive substrates |
| -scalable on substrates |
-limited to thin-film
applications |
|
CVD
|
-produces ultrathin, high-purity, crystalline films |
-high-temperature process |
| -scalable
for industrial applications |
-expensive equipment |
| -atomic-layer control |
-requires toxic
gas management |
|
ALD
|
-enables atomic-level thickness control |
-slow deposition rate |
| -conformal coating
on high-aspect-ratio structures |
-high cost for equipment/precursors |
| -low-temperature process |
|
|
solution-based/spin coating
|
-simple and low-cost processes |
-solvent residue
contamination |
| -vacuum-free |
-requires post-treatment |
| -flexible substrates |
|
|
sulfurization/selenization
|
-simple conversion process |
-requires
precise control of gas flow, vapor pressure, and
temperature |
| -high crystallinity |
-not suitable for thermally sensitive substrates |
| -easily adaptable to various substrates |
|
