Table 3.

The magnetic field, acquisition technique, temporal resolution, in-plane spatial resolution, and slice thickness of the ultrafast DCE studies

References	Magnetic field	Acquisition technique	Temporal resolution (sec/phase)	In-plane spatial resolution (mm)	Slice thickness (mm)
Mann56	3T	VS	4.32	1.0 × 0.9	2.5
Pineda106	3T	PI	6.9–9.9	1.5 × 1.5	3
Abe105	3T	PI	7	1.5 × 1.5	3
Onishi86	3T	CS	3.65	0.9 × 0.9	2.5
Mus59	3T	VS	4.32	1.0 × 0.9	2.5
Milenkovic´60	3T	VS	4.3	0.94 × 0.94	2.5
Mori107,112	3T	PI	3	1.09 × 1.66	4
van Zelst61	3T	VS	4.3	1.9 × 0.9	2.5
Cover62	3T	VS	4.26	N/A	2.2
Wu108	3T	PI	3.4–4.1	1.5 × 1.5	4
			1.7–3.5
Goto63	3T	VS	5.3	0.9 × 0.9	2.5
Honda87,89,92	3T	CS	3.7	0.9 × 0.9	2.5
Onishi64,66	3T	VS	2.7–7.1	1.6 × 1.6	1.6
Ohashi65	3T	VS	2.5	0.94 × 0.94	2.5
Shin67	3T	VS	3.8	1.11 × 1.24	1.0
			4.5	0.94 × 0.94	1.0
Kim68	3T	VS	3.8	1.1 × 1.1	1.0
			4.5	1.0 × 1.0	1.0
Yamaguchi109	3T	PI	8.3	0.9 × 0.9	2.5
Mori110	3T	PI	7	1.5 × 1.5	3
Peter69	3T	VS	4.9	0.9 × 0.9	2.5
Ohashi88,95,96	3T	CS	3.7	0.94 × 0.94	2.5
Jeong70	3T	VS	8.1	1.0 × 1.0	1.0
Lee71	3T	VS	6.5	1.6 × 1.6	1.6
Ayatollahi73	3T	VS	4.3	1.0 × 0.9	2.5
Pelissier74	1.5T	VS	7.1	1.38 × 1.17	2
Kim90	3T	CS	4.7	0.8 × 1.1	0.9
Kato111	3T	PI	3	1.09 × 1.66	4
Heo75	3T	VS	6.7	1.6 × 1.6	1.6
Jing76,79,81	3T	VS	4.3	0.91 × 0.91	3
	1.5T		5.2	0.68 × 0.68	3
Ramtohul77	1.5T	VS	5.9–6.0	1.1 × 1.6	4
Yamaguchi91,99	3T	CS	2.9	0.9 × 0.9	2.5
Kim78	3T	VS	6.5	0.78 × 0.78	3
Kim43	3T	VS	4	0.9 × 0.9	1
Ren113,114	3T	PI	3–9	1.5 × 1.5	3–4
Nissan104	3T	CS	6.1	1.3 × 1.3	1.5
Ramli Hamid80	3T	VS	3.7	1.0 × 0.9	2.5
Cao93,94,98	3T	CS	4.5	0.9 × 0.9	2.5
Milon115	3T	N/A	7.28	1.2 × 2.6	2.8
	1.5T			1.2 × 2.7	2
Miceli82	3T	VS	5	1.2 × 0.94	2.5
Lyu84	3T	VS	7	N/A	1.2
Kim97	3T	CS	4.5	0.7 × 0.7	0.8
Luo83	3T	VS	12	N/A	2.5
Xie85	3T	VS	4.7	N/A	2.1
Huang100	3T	CS	4.5	0.9 × 0.9	2.5

CS, compressed sensing; PI, parallel imaging; VS, view-sharing.