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. 2025 Aug 22;15:30978. doi: 10.1038/s41598-025-17058-2

Table 3.

Length percentage of the CSL grain boundary of Cu-Cu direct bonding interfaces at different bonding temperatures.

CSL
type
Temperature(℃)
110 115 120 125 130 135 140 145 150
Σ3 19.78% 24.57% 39.68% 45.88% 44.81% 41.42% 53.04% 42.18% 46.41%
Σ9 13.19% 11.75% 23.81% 10.26% 9.14% 15.34% 16.85% 9.52% 8.08%
Σ19a 10.99% 11.54% 6.35% 9.26% 13.81% 9.79% 12.71% 9.39% 15.57%
Σ19b 20.88% 23.93% 12.70% 20.93% 12.27% 13.43% 9.39% 11.16% 11.68%
Σ27a 35.16% 28.21% 12.70% 13.68% 19.98% 8.65% 8.01% 27.76% 18.26%