Table 7.

Process conditions and weight loss of material obtained in lapping using different metallic and non-metallic tools.

Tool type	Workpiece material	Abrasive Type	Process parameters		Processing time t [min]	Weight loss of material after a processing time t Δm [mg]
			Max rotational speed of a tool nt [min−1]	Max unit pressure p [kPa]
Segmented polyamide disc printed by SLS - under investigation in the article	Al2O3	Suspension with mixed SD 28/20 and D107 diamond grains	120	12	120	4041
UV-curable resin bond diamond lapping plate [32]	Al2O3	Diamond grains with an average size of 15 μm fixed in the resin bond	50	1.77	60	122
Conventional disc made of cast iron [32]	Al2O3	Suspension containing diamond grains with an average size of 15 μm	50	1.77	60	185
Conventional disc made of cast iron [33]	Tellurium copper	Paraffin and oil-based slurry with black silicon carbide grains (98 C F500)	64	3.79	90	932
Electroplated diamond disc with the nickel plating ratio Tb = 35% [5]	Al2O3	D107 diamond grains fixed in the thinnest nickel bond	60	14	18	523
Electroplated diamond disc with the nickel plating ratio Tb = 50% [5]	Al2O3	D107 diamond grains fixed in the nickel bond of the medium thickness	60	14	18	631
Electroplated diamond disc with the nickel plating ratio Tb = 65% [5]	Al2O3	D107 diamond grains fixed in the thickest nickel bond	60	14	18	741