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. 2025 Aug 20;15(36):29335–29366. doi: 10.1039/d5ra04586j

Table 1. Summary of electrical and optical properties of the layer, and device properties for various device configurations.

Device configuration Electrical characteristics of layer Optical property of layer Device properties
Effective mass Band gap (eV) Direct/indirect band gap Mobility (cm2 V−1 s−1) Real part of permittivity Imaginary part of permittivity λ mid (nm) Peak power spectral density (W cm−1 eV−1) LEE (%)
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Pristine 2.54 1.78 2.57 Direct 277 198 7.65(λb) 3.57(λb) 476 4.87 10.27
5.46(λg) 0.33(λg)
5.29(λr) 0.13(λr)
VC — — 1.13 Indirect — — — — — — —
VSi — — 2.21 Indirect — — — — — — —
V2C — — 0.95 Indirect — — — — — — —
V2Si — — 0.64 Indirect — — — — — — —
VSiC — — 0.95 Indirect — — — — — — —
CSi 2.44 1.66 1.99 Direct 288 212 — — 612 3.59 —
SiC — 2.00 Indirect — — — — — — —
Si ↔ C 2.13 2.87 1.41 Direct 330 122 — — 855 2.28 —
AsSi 3.84 1.73 1.96 Direct 183 203 4.94(λb) 6.42(λb) 619 3.59 21.53
7.01(λg) 2.62(λg)
6.59(λr) 1.32(λr)
BiSi — — 2.00 Indirect — — — — — — —
GaSi 3.14 2.0 2.50 Direct 224 176 4.92(λb) 2.78(λb) 490 4.74 17.55
3.44(λg) 0.46(λg)
1.45(λr) 0.42(λr)
GeSi — — 2.51 Indirect — — — — — — —
InSi 2.38 2.14 2.45 Direct 296 165 — — 500 4.57 8.18
PSi 3.14 1.76 2.01 Direct 224 200 6.39(λb) 0.77(λb) 606 3.68 12.66
6.85(λg) 2.42(λg)
6.44(λr) 6.82(λr)
PbSi 2.33 1.90 2.47 Direct 302 185 4.32(λb) 4.22(λb) 495 4.62 26.85
0.85(λg) 0.78(λg)
2.94(λr) 0.77(λr)
SbSi — — 2.01 Indirect — — — — — — —
SnSi 2.71 1.85 2.50 Direct 259 190 — — 490 4.73 11.29
TeSi 6.28 1.69 1.38 Direct 112 208 — — 871 2.38 10.41
CaSi 2.94 14.5 2.31 Direct 239 24 4.56(λb) 7.5(λb) 529 4.15 16.03
4.65(λg) 1.77(λg)
2.95(λr) 1.65(λr)
KSi 2.22 15.98 1.85 Direct 316 22 4.79(λb) 8.13(λb) 660 3.15 22.57
7.47(λg) 1.76(λg)
4.38(λr) 0.96(λr)
MgSi 3.44 2.74 2.49 Direct 204 128 4.51(λb) 5.18(λb) 492 4.69 21.46
2.36(λg) 1.29(λg)
0.08(λr) 1.50(λr)
NC — — 2.54 Indirect — — — — — — —
BC 2.87 2.59 2.13 Direct 245 135 7.01(λb) 4.21(λb) 570 3.93 20.48
4.65(λg) 1.62(λg)
3.24(λr) 0.72(λr)