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. 2025 Aug 20;15(36):29335–29366. doi: 10.1039/d5ra04586j

Table 1. Summary of electrical and optical properties of the layer, and device properties for various device configurations.

Device configuration Electrical characteristics of layer Optical property of layer Device properties
Effective mass Band gap (eV) Direct/indirect band gap Mobility (cm2 V−1 s−1) Real part of permittivity Imaginary part of permittivity λ mid (nm) Peak power spectral density (W cm−1 eV−1) LEE (%)
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Pristine 2.54 1.78 2.57 Direct 277 198 7.65(λb) 3.57(λb) 476 4.87 10.27
5.46(λg) 0.33(λg)
5.29(λr) 0.13(λr)
VC 1.13 Indirect
VSi 2.21 Indirect
V2C 0.95 Indirect
V2Si 0.64 Indirect
VSiC 0.95 Indirect
CSi 2.44 1.66 1.99 Direct 288 212 612 3.59
SiC 2.00 Indirect
Si ↔ C 2.13 2.87 1.41 Direct 330 122 855 2.28
AsSi 3.84 1.73 1.96 Direct 183 203 4.94(λb) 6.42(λb) 619 3.59 21.53
7.01(λg) 2.62(λg)
6.59(λr) 1.32(λr)
BiSi 2.00 Indirect
GaSi 3.14 2.0 2.50 Direct 224 176 4.92(λb) 2.78(λb) 490 4.74 17.55
3.44(λg) 0.46(λg)
1.45(λr) 0.42(λr)
GeSi 2.51 Indirect
InSi 2.38 2.14 2.45 Direct 296 165 500 4.57 8.18
PSi 3.14 1.76 2.01 Direct 224 200 6.39(λb) 0.77(λb) 606 3.68 12.66
6.85(λg) 2.42(λg)
6.44(λr) 6.82(λr)
PbSi 2.33 1.90 2.47 Direct 302 185 4.32(λb) 4.22(λb) 495 4.62 26.85
0.85(λg) 0.78(λg)
2.94(λr) 0.77(λr)
SbSi 2.01 Indirect
SnSi 2.71 1.85 2.50 Direct 259 190 490 4.73 11.29
TeSi 6.28 1.69 1.38 Direct 112 208 871 2.38 10.41
CaSi 2.94 14.5 2.31 Direct 239 24 4.56(λb) 7.5(λb) 529 4.15 16.03
4.65(λg) 1.77(λg)
2.95(λr) 1.65(λr)
KSi 2.22 15.98 1.85 Direct 316 22 4.79(λb) 8.13(λb) 660 3.15 22.57
7.47(λg) 1.76(λg)
4.38(λr) 0.96(λr)
MgSi 3.44 2.74 2.49 Direct 204 128 4.51(λb) 5.18(λb) 492 4.69 21.46
2.36(λg) 1.29(λg)
0.08(λr) 1.50(λr)
NC 2.54 Indirect
BC 2.87 2.59 2.13 Direct 245 135 7.01(λb) 4.21(λb) 570 3.93 20.48
4.65(λg) 1.62(λg)
3.24(λr) 0.72(λr)