Table 9.

Technical Specifications for Bidirectional, Wireless Communication Modules.

	Bidirectional Communication Module	CMOS System-on-Chip TX/RX Module
Publication Identifier	[222]	[221]
Clinical Readiness	Academic Research	Academic Research
Transmission Type	RF	RF
External Coil Size (Diameter)	42 mm (diameter)	2 × 2 cm
Repeater Coil Size	20 mm (diameter)	none
On-Chip Coil Size (mm)	10 mm (diameter)	2.25 mm
Powering Frequnecy	3.1–7 GHz	250 MHz
Down Link Rate	500 Mbps	150 Mbps
Up Link Rate	100 Mbps	2.5 MHz
Transmission Scheme	on off keying or binary shift keying	on off keying, amplitude key shifting
Device Size (um)	1000 × 800	2400 × 2200 × 300
CMOS Tech (um)	0.18	0.18
Chip Power (uW)	10,400	2.6
Working Distance (cm)	1	15
Testing	Testing with “fresh animal tissues” to mimic skin, fat, bone, and brain layers.	Testing PCB, power transmitted through 1 cm thick chicken breast.