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. 2025 Nov 1;25(21):6689. doi: 10.3390/s25216689
Acronyms
2-DOF PID Two-Degree-of-Freedom PID Controller
ABS Acrylonitrile Butadiene Styrene
ADC Analogue-to-Digital Converter
AMIGO Approximate M-constrained Integral Gain Optimization
CC Cohen–Coon
CHR Chien–Hrones–Reswick
COP Coefficient of Performance
DC Direct Current
EPS Expanded Polystyrene
IAE Integral Absolute Error
ISE Integral Square Error
ITAE Integral of Time-multiplied Absolute Error
MAE Mean Absolute Error
MDPM Multiple Dominant Pole Method
MedAE Median Absolute Error
MPC Model Predictive Control
MSE Mean Squared Error
NTC Negative Temperature Coefficient
PID Proportional–Integral–Derivative controller
PLA Polylactic Acid
PWM Pulse Width Modulation
RMSE Root Mean Square Error
SD Standard Deviation
SIMC Skogestad Internal Model Control
TV Total Variation
ZN Ziegler–Nichols
Symbols
A Internal surface area of the chamber (m2)
CD, CDc, CDh Inner-loop PID controllers: general, cooling branch, heating branch
Cp Specific heat of air (J·kg1·K1)
Cpc Specific heat of the module assembly (J·kg1·K1)
CT Outer-loop PID controller for chamber air temperature
COPc, COPh Coefficient of performance for cooling and heating
D Duty cycle of the PWM control signal
D0 Duty cycle operating point
G Geometrical factor (area/length) (m)
GD Transfer function from duty cycle to module temperature
GT Transfer function from module temperature to chamber air temperature
I Electrical current (A)
Icell Current through the thermoelectric module (A)
Icell0 Current through the module operating point (A)
Imax Maximum rated current of the module (A)
K Thermal conductance of the module (WK1)
Kb Anti-windup back-calculation constant
Kp Proportional gain of the PID controller
kθ Thermal conductivity (Wm1K1)
L, L Transport delay (dead time) in the thermal systems (min)
mc Lumped mass of the module assembly (kg)
Nc Number of thermoelectric modules
Nu Number of thermocouple pairs in a module
Pe Electrical power input to the module (W)
Q˙c Heat absorbed at the cold side of the module (W)
q˙cell Heat produced or absorbed by a single module (W)
Q˙h Heat rejected at the hot side of the module (W)
Q˙Peltier Ideal Peltier heat flow (W)
S Seebeck coefficient (VK1)
sα Elemental Seebeck coefficient (VK1)
T Temperature (K or °C)
Tc Cold face temperature of the module (K)
Tcell Temperature of the module face (K)
Tcell0 Module temperature operating point (K)
Td Derivative time of the PID controller (min)
Th Hot face temperature of the module (K)
Th0 Reference module hot-side temperature from datasheet (K)
Ti Integral time of the PID controller (min)
Tin Chamber air temperature (K)
Tin0 Chamber air temperature operating point (K)
T External ambient temperature (K)
U Overall heat-transfer coefficient of the chamber enclosure (Wm2K1)
V Internal volume of the chamber (m3)
VCC Supply voltage rail for the module (V)
Vcell Voltage applied to the module (V)
Ve Electrical voltage (V)
Vmax Maximum rated voltage of the module (V)
R Electrical resistance of the module (Ω)
R2 Coefficient of determination
Rθ Effective thermal resistance between modules and chamber air (KW1)
Γ Gain of module-temperature to air-temperature transfer function (°C/°C)
ΔT Temperature difference (K)
ΔTmax Maximum temperature difference across the module (K)
η Derivative filter constant in the PID controller
λ, μ Setpoint weighting factors in 2-DOF PID controller
ν Low-pass filter constant in the Smith predictor
Π Peltier coefficient (V)
ρ Air density (kg·m3)
ρe Electrical resistivity (Ωm)
τ, τ Time constants of the thermal systems (min)
Ω Gain of duty-cycle to module-temperature transfer function (°C)