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. 2025 Nov 7;25(22):6819. doi: 10.3390/s25226819
CMOS Complementary Metal-Oxide-Semiconductor
CO2 Carbon Dioxide
DRIE Deep Reactive Ion Etching
FEA Finite Element Analysis
FDTD Finite-Difference Time-Domain
IR Infrared
MEMS Micro-Electro-Mechanical Systems
MIM Metal–Insulator–Metal
MOSFET Metal-Oxide-Semiconductor Field-Effect Transistor
PDK Process-Development-Kit
NDIR Non-Dispersive Infrared
SOI Silicon-On-Insulator
WLP Wafer-Level Vacuum Packaging