3D-IC	Three-Dimensional Integrated Circuit
Ag	Silver
Au	Gold
BCIT	Barker Code Infrared Thermography
BGA	Ball Grid Array
BP	Back Propagation
CMP	Chemical Mechanical Polishing
Cu	Copper
DBA	Direct Bonded Aluminium
DBC	Direct Bonded Copper
DBSCAN	Density-based Spatial Clustering of Applications with Noise
DIC	Digital Image Correlation
ECPT	Eddy Current Pulse Thermography
EM	Electromigration
FC	Flip-Chip
FCM	Fuzzy C-means clustering
HOG	Histogram of Oriented Gradient
I/O	Input/Output
IC	Integrated Circuit
IMC	Intermetallic Compounds
IRT	Infrared Thermography
LFMTWI	Linear Frequency Modulation ThermalWave Imaging
LIT	Lock-in Infrared Thermography
LM-BP	Levenberg-Marquardt Back Propagation
LUT	Laser Ultrasonic
NDE/T	Nondestructive Evaluation/Testing
NDT	Nondestructive Test
RoI	Region of Interest
SAM	Scanning Acoustic Microscope
SiP	ystem-in-Pakcage
SNR	Signal-to-Noise Ratio
TAB	Tape Automated Bonding
ToF	Time-of-Flight
TSV	Through Silicon Vias
UBM	Under Bump Metallization
UT	Ultrasonic Test
VDSR	Very Deep Super Resolution
WB	Wire Bonding
XCT	X-ray Computed Tomography
XRM	X-ray Microscopy