Table 2. Proposed encapsulants of PSCs with reported device performance and test conditions.

Encapsulation material	Initial PCE	Durability of the standard test	Conditions	Retention of peak PCE	Standardized tests performed	Ref.
Thiol-functionalized perfluoroalkyl	21.79%	500 h	85 °C, MPP at N2-filled chamber	90.1%	No	87
		500 h	Room temperature 85% RH	95%
Polyacrylic acid (PAA) ionogel	22.87%	1000 h	85 °C, 85% relative humidity	95.2%	Damp heat, thermal cycling	88
		200 cycles	−40 to 80 °C cycling	96.1%
DMDP (front), EDTMP-PEO (back)	20.27%	500 h	MPP at room temperature	80%	No	45,89
Multilayer Al2O3 and pV3D3	20.1%	300 h	50 °C, 50% relative humidity, dark	98.9%	No	90
Alucone and Al2O3 bilayer stack	17.01%	2100 h	30 °C, 80% relative humidity, dark	96%	No	91
Al2O3 and 1H, 1H, 2H, 2H-perfluoro decyl-trichlorosilane stack	19.7%	500 h	85 °C, 85% relative humidity	78%	Damp heat not long enough
PIB wide blanket	19%	1800 h	85 °C, 85% relative humidity	95%	Damp heat and humidity freeze	92
		30 cycles	−40 to 80 °C cycling	95%
Resin UVR-C (front), C100 (back)	25.5%	500 h	Ambient conditions	97%	No	93
Sulfonic acid-based resin	20.1%	500 h	45 °C, MPP, ambient RH	83%	No	94