| MEMS | Micro-electro-mechanical systems |
| SOI | Silicon-on-insulator |
| FOS | Fiber optic sensors |
| FBG | Fiber Bragg grating |
| DRIE | Deep reactive ion etching |
| BOX | Buried oxide |
| KOH | Potassium hydroxide |
| BOE | Buffered oxide etch |
| ICP | Inductively coupled plasma |
| MEMS | Micro-electro-mechanical systems |
| SOI | Silicon-on-insulator |
| FOS | Fiber optic sensors |
| FBG | Fiber Bragg grating |
| DRIE | Deep reactive ion etching |
| BOX | Buried oxide |
| KOH | Potassium hydroxide |
| BOE | Buffered oxide etch |
| ICP | Inductively coupled plasma |