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. 2026 Mar 26;26(7):2076. doi: 10.3390/s26072076
MEMS Micro-electro-mechanical systems
SOI Silicon-on-insulator
FOS Fiber optic sensors
FBG Fiber Bragg grating
DRIE Deep reactive ion etching
BOX Buried oxide
KOH Potassium hydroxide
BOE Buffered oxide etch
ICP Inductively coupled plasma