Skip to main content
. 2026 Apr 15;16(8):468. doi: 10.3390/nano16080468
SEM Scanning Electron Microscope
CCLs Copper-Clad Laminates
TSMC Taiwan Semiconductor Manufacturing Company
CTE Coefficient of Thermal Expansion
PPE Polyphenylene Ether
CIE Commission Internationale de l’Éclairage
XRD X-ray Diffraction
EDS Energy Dispersive Spectroscopy