TSV	Through-Silicon Via
UPD	Ultra-Precise Dispensing
3D ICs	Three-Dimensional Integrated Circuits
CMP	Chemical–Mechanical Polishing
AM	Additive Manufacturing
IJ	Inkjet
EHD	Electrohydrodynamic
CMOS	Complementary Metal–Oxide Semiconductor
PECVD	Plasma-Enhanced Chemical Vapor Deposition
EBE	E-Beam Evaporation
LOP	Lift-Off Process
RIE	Reactive Ion Etching
DRIE	Deep Reactive Ion Etching
ALD	Atomic Layer Deposition
SEM	Scanning Electron Microscopy
PFIB	Plasma Focused Ion Beam
CTE	Coefficient of Thermal Expansion
TCT	Thermal Cycling Tests
EM	Electromigration