3D	three-dimensional
3D-AFM	three-dimensional atomic force microscopy
3D-SICs	3D stacked ICs
AAO	anodic aluminum oxide
AFM	atomic force microscopy
AFP	Atomic Force Profiler
AI	artificial intelligence
ALD	atomic layer deposition
ALE	atomic layer etching
APT	atom probe tomography
BEOL	backend-of-line
CCP	capacitively coupled plasmas
CD	critical dimension
CD-SAXS	critical dimension small-angle X-ray scattering
cryo-ALE	cryogenic atomic layer etching
CMOS	Complementary metal-oxide-semiconductor
CMP	chemical mechanical polishing
CNM	compliant nano-manipulator
CPEM	Correlative Probe and Electron Microscopy
CW	continuous wave
DRIE	Deep Reactive Ion Etching
eCD	enhanced CD
EELS	electron energy loss spectroscopy
EFEM	equipment front end module
ETD	estimated tip diameter
F2F	face-to-face
FA	fast scanning actuator
FC	fluorocarbon
FFTP	Feed Forward Trajectory Planning
FIB	Focus Ion Beam
FinFETs	Fin Field-Effect Transistor
GAA	gate-all-around
HAR	high-aspect-ratio
HARPs	High-Aspect-Ratio Probes
HBM	high-bandwidth memory
HHCF	height-height correlation function
HS-AFM	high-speed AFM
HS Met. LR-AFM	high-speed metrology large-range AFM
ICP	Inductively Coupled Plasma
ICs	integrated circuits
IE-AM	Image Explorer for Advanced Metrology
LER	Line Edge Roughness
LWR	line width roughness
M3D	monolithic 3D integration
MAFM	miniaturized AFM
MEMS	microelectromechanical System
ML	machine learning
MOS	metal-oxide-semiconductor
MOSFET	Metal-Oxide-Semiconductor Field-Effect Transistor
MWCNT	multiwall carbon nanotube
NBE	neutral beam etching
OCD	optical critical dimension
OES	Optical Emission Spectroscopy
OFP	optical fiber probes
OPC	optical proximity correction
PECVD	Plasma-Enhanced Chemical Vapor Deposition
PSD	Power Spectral Density
QALE	quasi-atomic layer etching
$R_{\mathrm{a}}$	average roughness
$R_{\mathrm{q}}$	root mean square roughness
RMS	root mean square
ROM	reduced order mode
${\mathrm{R}}_{\mathrm{p}-\mathrm{p}}$	peak-to-peak roughness
${\mathrm{R}}_{\mathrm{s}\mathrm{k}}$	skewness
${\mathrm{R}}_{\mathrm{k}\mathrm{u}}$	kurtosis
SAMs	self-assembled monolayers
SCEs	short-channel effects
SEM	scanning electron microscopy
SiP	system-in-package
SNOM	scanning near-field optical microscope
SoC	system-on-chip
SPMs	scanning probe microscopes
SWA	sidewall angle
TEM	transmission electron microscopy
TERS	Tip-Enhanced Raman Spectroscopy
tilting-mAFM	metrological tilting-AFM
TRS	transitional rescan
TSVs	through-silicon vias
TTM	two-temperature model
ULK	ultra-low-κ
ULSS-AFM	Ultra-large scan size AFM
VIA	Vertical Interconnect Access
VPS	vector probing scanning
WIW	within-wafer