5.
Codeposition of a metal (Cu) and a dielectric material (Mg(OH)2). (a, b) Two-channel nozzle used for multimaterial-class deposition. One channel is filled with 1 mM CuSO4 and the other is filled with 1 mM MgCl2. Best deposition results were obtained for orifice sizes around 160 nm. (c) EDX analysis of separate Cu and Mg(OH)2 pad indicates that the materials can be deposited separately from the same nozzle with little intermixing. Only a minor Cu peak can be observed in the Mg structure. (d) Low magnification image of a 5 by 5 μm Cu pad on top of a 10 by 10 μm magnesium hydroxide pad. The inset is shown in the EDX maps. The spatial distribution of Cu, Mg, and O indicates that Cu is only present in the square where it was deposited (the square at the top left in the Cu image originates from a shift in the position of the substrate during printing) and that Mg is mostly found in the larger pad surrounding the Cu. (e) Cross section of a Cu–Mg(OH)2–Cu multilayered structure. The first Cu layer delaminated from the Au substrate. Both Cu layers appear much brighter than the porous Mg(OH)2. Further, charging of the Mg(OH)2 layer can be observed as a brighter section within the layer.