| AI | Artificial intelligence |
| ALD | Atomic layer deposition |
| CTE | Coefficient of thermal expansion |
| CVD | Chemical vapor deposition |
| DC | Direct current |
| EBSD | Electron backscatter diffraction |
| FEA | Finite element analysis |
| HPC | High-performance computing |
| LIDE | Laser-induced deep etching |
| MEMS | Microelectromechanical systems |
| PVD | Physical vapor deposition |
| RF | Radio frequency |
| SLE | Selective laser etching |
| TGV | Through-glass via |
| TSV | Through-silicon via |