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. 2026 Jun 14;17(6):720. doi: 10.3390/mi17060720
AI Artificial intelligence
ALD Atomic layer deposition
CTE Coefficient of thermal expansion
CVD Chemical vapor deposition
DC Direct current
EBSD Electron backscatter diffraction
FEA Finite element analysis
HPC High-performance computing
LIDE Laser-induced deep etching
MEMS Microelectromechanical systems
PVD Physical vapor deposition
RF Radio frequency
SLE Selective laser etching
TGV Through-glass via
TSV Through-silicon via