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. 2026 Apr 21;16:19671. doi: 10.1038/s41598-025-32248-8

Table 1.

Specifications and Laser Parameters for 650 nm and 810 nm Diode Laser Groups.

810 nm Laser (Group A) 650 nm Laser (Group B)
Laser Type Diode Laser Diode Laser
Active Medium Gallium Aluminum Arsenide (GaAlAs) Indium Gallium Phosphide (InGaP)
Maximum Power Output 5000 mW 100 mW
Available Modes of Emission** Pulsed & Continuous Wave Continuous Wave
Beam Profile Gaussian Gaussian
Manufacturer Elexxion, Germany NILES, Egypt*
Wavelength Infra-Red: 810 nm Red: 650 nm
Power Output 100 mW (0.1 W) 100 mW (0.1 W)
Exposure Duration/point (s) 60 s 60 s
Energy per point (J) 6 J 6 J
Energy Density fluence/point (Inline graphic) 12Inline graphic 12Inline graphic
Emission Mode Used in Study** Continuous Continuous
Spot Size (Inline graphic) 0.5 0.5
Irradiated Points 3 (occlusal, buccal, palatal) 3 (occlusal, buccal, palatal)
Total Radiant Energy (J) 18 J 18 J
Total Energy Density (Inline graphic) 36Inline graphic 36Inline graphic
Application Technique Static Punch mode - contact Static Punch mode - contact
Treatment Sessions 6 sessions, 3 sessions/week 6 sessions, 3 sessions/week

*Device manufactured and calibrated by Dept. of Laser Applications in Engineering, National Institute of LASER Enhanced Sciences (NILES), Cairo University, Egypt. 

**The Available Emission Modes details the manufacturer-specified options of the device, while the Emission Mode Used in Study specifies the setting selected for the treatment protocol in this clinical trial.