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. Author manuscript; available in PMC: 2008 Apr 24.
Published in final edited form as: Thin Solid Films. 2007 Nov 1;516(1):34–41. doi: 10.1016/j.tsf.2007.04.050

Table I.

Deposition conditions of the a-SiCx:H films and selected characterization results

Deposition ID SiH4 -CH4 -H2 -Ts Substrate temperature Ts [H2] sccm Precusor ratio Hydrogen Dilution Si-C relative bond density ratio Deposition rate (nm/min) Refractive Index (η) at 500 nm
2–10–5–275 275°C 5 0.17 0.36 1.00 6.8 1.90
2–10–80–275 80 5.71 1.28 3.2 2.58
2–10–180–275 180 12.85 2.54 2.5 2.79

2–10–5–200 200°C 5 0.17 0.36 0.51 7.4 1.79
2–10–20–200 20 1.42 0.77 6.6 1.82
2–10–80–200 80 5.71 1.02 3.2 2.32
2–10–180–200 180 12.85 1.97 2.6 2.72

2–10–180–150 150°C 180 0.17 12.85 1.34 2.9 2.44

4–10–5–275 275°C 5 0.29 0.36 0.77 8.9 1.96
4–10–80–275 80 5.71 0.92 4.6 2.83

4–10–5–200 200°C 5 0.29 0.36 0.50 7.0 1.88
4–10–80–200 80 5.71 0.79 4.4 2.47

4–10–180–150 150°C 180 0.29 12.85 0.95 2.8 2.62