Table I.
Deposition ID SiH4 -CH4 -H2 -Ts | Substrate temperature Ts | [H2] sccm | Precusor ratio | Hydrogen Dilution | Si-C relative bond density ratio | Deposition rate (nm/min) | Refractive Index (η) at 500 nm |
---|---|---|---|---|---|---|---|
2–10–5–275 | 275°C | 5 | 0.17 | 0.36 | 1.00 | 6.8 | 1.90 |
2–10–80–275 | 80 | 5.71 | 1.28 | 3.2 | 2.58 | ||
2–10–180–275 | 180 | 12.85 | 2.54 | 2.5 | 2.79 | ||
| |||||||
2–10–5–200 | 200°C | 5 | 0.17 | 0.36 | 0.51 | 7.4 | 1.79 |
2–10–20–200 | 20 | 1.42 | 0.77 | 6.6 | 1.82 | ||
2–10–80–200 | 80 | 5.71 | 1.02 | 3.2 | 2.32 | ||
2–10–180–200 | 180 | 12.85 | 1.97 | 2.6 | 2.72 | ||
| |||||||
2–10–180–150 | 150°C | 180 | 0.17 | 12.85 | 1.34 | 2.9 | 2.44 |
| |||||||
4–10–5–275 | 275°C | 5 | 0.29 | 0.36 | 0.77 | 8.9 | 1.96 |
4–10–80–275 | 80 | 5.71 | 0.92 | 4.6 | 2.83 | ||
| |||||||
4–10–5–200 | 200°C | 5 | 0.29 | 0.36 | 0.50 | 7.0 | 1.88 |
4–10–80–200 | 80 | 5.71 | 0.79 | 4.4 | 2.47 | ||
| |||||||
4–10–180–150 | 150°C | 180 | 0.29 | 12.85 | 0.95 | 2.8 | 2.62 |