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. 2009 Feb 25;16(Pt 2):143–151. doi: 10.1107/S0909049508040429

Table 1. Summary of the diodes used in this study.

The silicon layer thicknesses were provided by the manufacturer for all diodes except the OSI and IRD devices; the thicknesses of these were experimentally determined (see Fig. 4).

Diode Manufacturer Model number Thickness of silicon layer (µm) Thickness of aluminium cover (µm)
1 OSI Optoelectronics S100VL (solderable chip series) 400 23.2
2 OSI Optoelectronics PIN-10DPI 400 16.4
3 OSI Optoelectronics S4CL 400 N/A
4 IRD AXUV100 300 N/A
5 Sintef CHICSi 12 12 20
6 Hamamatsu S9724-010 10 N/A
7 Hamamatsu S3204-09 300 N/A
8 Canberra PD300-500CB 500 N/A