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. Author manuscript; available in PMC: 2010 Jul 1.
Published in final edited form as: Sens Actuators B Chem. 2009 Jul;140(2):473–481. doi: 10.1016/j.snb.2009.04.071

Fig. 2.

Fig. 2

Simplified process flow for the microfluidic reactor array device (a) growing a thermal oxide layer; (b) defining the microreactor pattern to PR and thermal oxide layers; (c) defining the microchannel pattern to PR and thermal oxide layers; (d) etching a silicon wafer to create microchannels; (e) etching a silicon wafer to create microreactors; (f) defining the through inlet/outlet hole pattern to the backside of the wafer; (g) etching a silicon wafer to create the through-holes and (h) growing a thermal oxide and bonding to a glass wafer.