Skip to main content
. 2008 Jul 8;2(3):034101. doi: 10.1063/1.2959099

Figure 2.

Figure 2

Fabrication steps of the silicon∕glass chip: (a) Lithography of the channel structures (first mask), (b) DRIE of the channel structures, (c) lithography of the access holes (second mask), (d) DRIE of the access holes, and (e) anodic bonding of the glass cover.