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. Author manuscript; available in PMC: 2010 May 1.
Published in final edited form as: Anal Bioanal Chem. 2009 Mar 17;394(1):187–198. doi: 10.1007/s00216-009-2656-5

Fig. 3.

Fig. 3

Schematic diagram of multi-depth glass etching chip fabrication. (1) Deposit masking layers of amorphous silica (aSi) and photoresist. (2) Photolithography. (3) Dry etch aSi. (4) Wet etch glass with HF (5) Photolithography, etch aSi. (6) Etch with HF. (7) Remove masking layers. (8) Deposit titanium, gold, and photoresist. (9) Photolithography, wet etch metals. (10) Machine drill holes in top wafer. (11) Deposit aSi. (12) Anodic bonding