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. Author manuscript; available in PMC: 2010 Mar 17.
Published in final edited form as: J Vac Sci Technol B Microelectron Nanometer Struct Process Meas Phenom. 2009;27(6):2795–2800. doi: 10.1116/1.3258146

Fig. 3.

Fig. 3

Fabrication process of the Si mold for nanoimprint process: (a) imprinted SU-8, (b) transfer of pattern to SiO2 by fluorine ICP etch, (c) transfer of pattern to Si by chlorine ICP etch; (d) repeated oxidation and oxide removal by BOE, and (e) final Si mold.