Table 1.
Select properties of the materials used in the 9-well sample chip base and top designs
| Material | Total thickness | Fluorescent signal ± R.S.D.a | Optical transparencyb | General comments |
|---|---|---|---|---|
| PC | 125 μm | 309 ± 5.6 (neg) 1020 ± 9.6 (pos) |
≥300 nm | Hard to scratch, cut with laser cutter or scissors. |
| Mylar | 250 μm | 865 ± 4.4 (neg) 1419 ± 4.6 (pos) |
≥400 nm | Easy to scratch, cut with laser cutter or scissors. |
| Glass | 250 μm | 320 ± 7.1 (neg) 962 ± 6.9 (pos) |
≥350 nm | Hard to scratch, however fragile if apply force, cut with diamond cutter. |
| COC | 250 μm | 335 ± 6.3 (neg) 967 ± 5.3 (pos) |
≥250 nm | Easy to scratch, cut with scissors. |
a
Measured using the EL-CCD detector, from wells filled with buffer only (neg) and positive FITC-SNAP-25 (pos) samples. The 9-well sample chip was modified with the base material only, no top was attached to the chip.
b
Absorbance ≤0.2 (relative to an air background) as measured using a Amersham Biosciences UltoSpec 2100 pro UV–vis Spectrometer (GE Healthcare Life Sciences, Piscataway, NJ).