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. Author manuscript; available in PMC: 2010 Oct 1.
Published in final edited form as: IEEE Trans Biomed Circuits Syst. 2010 Apr 1;4(2):86–92. doi: 10.1109/TBCAS.2009.2033706

Fig. 3.

Fig. 3

(a) A photograph of a CMOS chip in the package and a microscopic image of the bonding pads and wire bonds. (b) Photograph of the CMOS chip covered with epoxy excluding the boxed area. Microscopic image showing the epoxy covered and exposed areas