Figure 1.

Computer-aided design depicting the architecture of the sensor implant (A). The sensor chip, incorporating a differential pressure transducer located at the front, followed by the ASIC (including temperature compensation) and components of the inductive powering and telemetry interface. The membrane and the inductive coil antenna are assembled on the reverse side. The whole unit is encapsulated in epoxy resin (Araldite 2020), with a filler channel enabling injection of the aqueous osmotic active solution prior to operation. (B) Assembled prototype carrier and capsule. An optional venting channel assisted filling in early versions.