Skip to main content
. 2010 Sep 7;4(3):036503. doi: 10.1063/1.3487796

Table 1.

Comparisons of bonding strength of microfluidic chips carried out with different materials.

Chip materials Silicon-silicona PDMS Paper-glass Paper-PMMA
Method Low temperature (400 °C) Half-cure bonding Plasma bonding Acrylic resin Acrylic resin
Bonding strength 25 MPa 50 kPa 200 kPa 5 MPa 8 MPa
a

The silicon-silicon bonding strength data were cited in Ref. 33.