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. Author manuscript; available in PMC: 2011 Jan 11.
Published in final edited form as: Nanotechnology. 2010 Aug 12;21(36):365302. doi: 10.1088/0957-4484/21/36/365302

Figure 6.

Figure 6

SEM images at each process step; [(a) and (d)] 5 W biased Cr, [(b) and (e)] SiO2 deposition, and [(c) and (f)] after etching. The Cr and SiO2 deposition times were 5 and 1 min, which corresponded to 10.5 nm and 123 nm, respectively; (a) – (c) top, and (d) -(f) 45° tilt view.