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. Author manuscript; available in PMC: 2011 Jul 20.
Published in final edited form as: IEEE Trans Nanotechnol. 2010 May;9(3):269–280. doi: 10.1109/TNANO.2009.2031807

Fig. 4.

Fig. 4

Schematic diagram outlining unique advantages of bottom-up NW assembly, including (a) nanotopographic morphology, (b) ability to assemble devices on flexible, transparent substrates, (c) assembly of distinct NW materials on the same chip, and (d) high spatial resolution of NW devices, where S and D correspond to source and drain electrodes.