Table 1.
CVD system | Si source gas | N source gas | RF/MW power (W) | Film thickness (Å) | Deposition rate (Å/min) |
---|---|---|---|---|---|
PECVD | 5% SiH4/Ar | NH3 | 50 | 2200-2600 | 110-130 |
ICP CVD | 30% SiH4/Ar | N2 | 300 | 2400-3000 | 26-30 |
ECR PECVD | 30% SiH4/Ar | 10% N2/Ar | 500 | 800-1200 | 53-60 |