Skip to main content
. 2011 Apr 7;6(1):301. doi: 10.1186/1556-276X-6-301

Table 1.

Processing conditions used for depositing the VO2 films

W- and Mo-doped films Nb-doped films
Base pressure (mbar) 3 × 10-5 3 × 10-5
Work pressure (mbar) 4 × 10-3 1 × 10-3
Oxygen/argon ratio (%) 14.3 50
Total gas flow (sccm) 19.2 6
DC current (A) 0.5 -
Pulsed-DC current (A) - 0.58
Frequency (kHz) - 10
Reverse time (μs) - 5
Substrate temperature (°C) 450 450
Deposition time (min) 5 3