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. 2010 Nov 24;10(12):10524–10544. doi: 10.3390/s101210524

Figure 10.

Figure 10.

(a) 2nd photolighography & TEOS etch. (b) 1st DRIE. (c) 2nd DRIE. (d) Thermal oxidation & bottom etch. (e) 3rd DRIE. (f) Anisotropic wet etching. (g) Thinner TEOS etch & 4th DRIE. (h) Passivation layer removal. The ESBM fabrication process flow.