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. 2010 Nov 24;10(12):10524–10544. doi: 10.3390/s101210524

Figure 13.

Figure 13.

(a) Overall view of the fabricated silicon structure. (b) Magnified view of the fabricated vertical gap between interdigitated comb-fingers. (c) Cross-sectional view of the fabricated sensing element. (d) Magnified view of the metal interconnection layer and through via-hole. (e) Hermetic packaged MEMS sensing element. Fabricated MEMS out-of-plane microaccelerometer.