Table 2.

Summary of MEMS packaging requirements versus standard integrated circuit packaging (adapted from [113]).

Bio-MEMS Applications	Standard Integrated Circuits
Often involve moving solids or fluids	Stationary thin solid structures
Require integration of microstructures with microelectronics	No such integration is required
Perform a variety or functions of biological, chemical, optical and electromechanical nature	Transmit electrical signals only
Many components are required to interface with working media and hostile environments	Integrated circuit die are protected from working media by encapsulation
Fewer electrical connections and leads	Large number of electrical connections and leads
Lack of engineering design methodology and standards	Well-established design methodology and standards
Packaging technology is in its infancy	Mature packaging technology and clearly defined roadmaps
Assembly is primarily manual	Highly automated assembly techniques available
Lack of quality and reliability testing standards and test facilities	Mature standards and established quality and reliable testing facilities
Distinct manufacturing techniques for each application	Manufacturing techniques are proven and well documented
No industrial standards to follow in design, manufacture, packaging and testing	Well-established methodologies and procedures