Table 3.
Constraints (for commercially-viable solutions) | Emerging Characteristics |
---|---|
use of standard CMOS technologies(mature processes: low cost; high availability) | bondpad modification using plating |
high spatial resolution (for MEAs) using addressable sensor arrays | |
no complex post-processing of ICs (e.g., no additional lithography) | minimised cleft by using specific adhesion layer peptides |
useful lifetimes for long in vitro assays or long-term (chronic) implantation | improved packaging based on MEMS technology |
robust signal amplification using very low-noise amplifier designs |