Table 2.

Sensor Dimension and Material Properties.

Symbol	Description	Value
Mechanical:
Epoly	Polysilicon Young’s modulus	160 GPa
E	Effective Young’s modulus of the beam	70 GPa
m	Proof mass weight	105 μg
Geometric:
Wb	Cantilever beam width	13 μm
Hb	Cantilever thickness from polysilicon layer	4.2 μm
Lb	Cantilever beam length	200 μm
Lpm	Proof mass length	500 μm
Wpm	Proof mass width	500 μm
Lpoly	Length of poly resistor	49.4 μm
Wpoly	Width of poly resistor	1.2 μm
Electrical:
ρs	Polysilicon sheet resistance	26.1 Ω/square
αpoly	Polysilicon temperature coefficient of resistance (TCR)	2.1 × 10−3 K−1*
ρpoly	Polysilicon resistivity	9.14 Ωμm
Thermal:
κAl	Aluminum thermal conductivity	237 W/(K.m)
κox	SiO2 thermal conductivity	1.1 W/(K.m)
κSi	Silicon thermal conductivity	170 W/(K.m)
κpoly	Polysilicon thermal conductivity	29 W/(K.m)

^*Note: This data is obtained from the temperature characterization on the fabricated device.