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. 2011 Nov 28;11(12):11206–11234. doi: 10.3390/s111211206

Figure 11.

Figure 11.

(a) Optical photograph of a solder bonded microaccelerometer chip about 10 × 10 × 3 mm3, where the pads are coated with solder bumps. (b) and (c) Microphotographs of the partly enlarged microaccelerometer chip, seen through the bonded top glass stator.