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. Author manuscript; available in PMC: 2012 Feb 3.
Published in final edited form as: Adv Mater. 2010 Sep 22;22(36):4030–4033. doi: 10.1002/adma.201000515

Figure 4.

Figure 4

Architecture for an elastic, multichip module (not to scale). PCBs, prefabricated silicon ICs, and thin-film discrete components of various types can all be integrated into such a composite and interconnected using multilayer via-bonding technology to form a module-level circuit. (a) Components aggregate in stacked 3-D islands. This architecture can maximize the system-level stretchability. (b) Components are not stacked. This architecture gives more design flexibility.