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. Author manuscript; available in PMC: 2012 Feb 3.

Published in final edited form as: IEEE Trans Ultrason Ferroelectr Freq Control. 2011 Jun;58(6):1189–1202. doi: 10.1109/TUFFC.2011.1929

Fig. 5 — Illustrative stack of transducer fabrication (not to scale). PZT is bonded to the polyimide flex circuit and diced, then two-sided LCP is bonded to the PZT. A lossy backing is bonded to the back of the flex (not shown).

Inline graphic — Illustrative stack of transducer fabrication (not to scale). PZT is bonded to the polyimide flex circuit and diced, then two-sided LCP is bonded to the PZT. A lossy backing is bonded to the back of the flex (not shown).