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. 2010 May 17;10(5):4950–4967. doi: 10.3390/s100504950

Table 1.

Etching rates of silicon at different KOH concentrations at 70 °C [17,18].

Crystallographic Orientation 30% 40% 50%

(100) 0.797 0.599 0.539
(110) 1.455 1.294 0.870
(210) 1.561 1.233 0.959
(211) 1.319 0.950 0.621
(221) 0.714 0.544 0.322
(310) 1.456 1.088 0.757
(311) 1.436 1.067 0.746
(320) 1.543 1.287 1.013
(331) 1.160 0.800 0.489
(530) 1.556 1.280 1.033
(540) 1.512 1.287 0.914
(111) 0.005 0.009 0.009
(411) 1.340 0.910 0.660