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. Author manuscript; available in PMC: 2012 Mar 5.
Published in final edited form as: IEEE Trans Compon Packaging Manuf Technol. 2011 Dec 1;1(12):1996–2004. doi: 10.1109/TCPMT.2011.2166395

Fig. 6.

Fig. 6

Process steps to integrate a chip using only SOG. (a) The holder and the chip are placed face-down on a handle substrate. (b) SOG is spun on the backside of the chip and the holder to fill the gap and planarize the bottom surface. (c) The handle substrate is removed, and the planarization is performed on the top surface of the chip and the holder.