Skip to main content
. 2012 Apr 3;6(2):024102–024102-14. doi: 10.1063/1.3699971

Figure 1.

Figure 1

Rapid prototyping of ultra thick devices. (a) Workflow of the technique: (1)—laser cutting of a PMMA negative relief pattern, (2)—dust particles removal, and (3)—PMMA thermal bonding. C-clamps are used to apply a uniform mechanical force during the bonding process, (4)—PDMS replica moulding. Note that PDMS does not bind electrostatically or covalently to PMMA allowing rapid removal without the need for releasing agents. (b) 1.5 mm thick negative relief pattern fabricated using laser cutting of PMMA. Note that small distortion of the pattern due to the laser cone geometry. Red arrow denotes the direction of the cutting laser beam, (c) Magnified view of the complex PMMA relief pattern for hydrodynamic trapping of single zebrafish embryos. Reflow of the polymer during the thermal bonding of PMMA layers removes the visible surface imperfections.