Table 1.
The recent developed SMO thin film based resistance hydrogen sensors.
| Materials | Synthesis Method | Working Temp. (°C) | Detected Conc. (ppm) | Hydrogen response | Ref. | |||
|---|---|---|---|---|---|---|---|---|
| Smax | Conc. (ppm) | tresponse | Temp. (°C) | |||||
| SnO2 | Sol-gel annealing | 100–300 | 50–5,000 | 104 | 5,000 | <10 s | 100 | [65] |
| In2O3 doped SnO2 | Sol-gel annealing | 22 | 100–15,000 | 105 | 15,000 | tens of min. | 22 | [83] |
| (101)-SnO2 | RF magnetron sputtering | 550 | 300–10,000 | 300 | 10,000 | <16 s | 550 | [70] |
| SWCNT doped SnO2 | Sol-gel annealing | 150–300 | 300–1,500 | 3 | 1,500 | <5 s | 250 | [80] |
| Au or Pt enhanced SnO2 | Sol-gel annealing | 85–180 | 500–10,000 | 2 | 10,000 | several min. | 150 | [79] |
| SnO2 | Spray pyrolysis | 250–400 | 1,000 | 3,040 | 1,000 | 2 s | 350 | [121] |
| Pd doped SnO2 | Reactive Magnetron sputtering | 50–300 | 10–1,000 | 85 | 1,000 | several mins | 200 | [60] |
| SnO2 | Sol-gel annealing | 90–220 | 1,000 | 2,000 | 1,000 | 15 s | 150 | [66] |
| Al-doped ZnO | HF magnetron sputtering | 40–100 | 1,000–5,000 | 10 | 1,000 | 10 min | 100 | [76] |
| ZnO wirelike thin film | Thermal oxidation | 200 | 200 | 2.83 | 200 | 1.5 min | 200 | [68] |
| ZnO | Thermal oxidation | 400 | 40–160 | 4,000 | 160 | 1,000 s | 400 | [122] |
| Mg-doped ZnO | PLD | 150–300 | 5–5,000 | 50 | 5,000 | 5 min | 300 | [77] |
| Nanoporous TiO2 | Thermal oxidation | 500 | 5–500 | 10 | 500 | 10 s | 500 | [11] |
| Nanoporous TiO2 | Anodic oxidation | 100–300 | 1,200–10,000 | 1.24 | 10,000 | - | 225 | [67] |
| Anatase TiO2 | Micro-arc oxidation | 100–300 | 1000 | 2.5 | 1,000 | 45 s | 250 | [71] |
| Nb2O5 NW thin film | Thermal oxidation | 20 | 100–2,000 | 50 | 2,000 | <2 min | 20 | [69] |
| MWCNT-doped WO3 | Electron beam evaporation | 200–400 | 100–50,000 | 3 | 1,000 | - | 350 | [81] |
| Pd-doped WO3 | Sol-gel annealing | 20–350 | 1,000–1,300 | 104 | 1,000 | <100 s | 20 | [78] |
| Pt-doped WO3 | RF magnetron sputtering | 95–220 | 30–200 | 9.5 | 200 | 0.7 min | 200 | [123] |
| CuO | Thermal oxidation | 300–800 | 60,000 | 3.72 | 60,000 | 5 min | 250 | [72] |
| NiO | PLD | 25–250 | 30,000 | 1.16 (n) 1.76 (p) | 30,000 | 10 min | 125 | [124] |
| NiO | Magnetron sputtering | 300–650 | 500–10,000 | 190 (p) | 5,000 | 5 min | 400 | [74] |