Skip to main content
. 2012 Jul 24;6(3):034106. doi: 10.1063/1.4738587

Figure 3.

Figure 3

Schematics and photographs of the adapter module made of polycarbonate including the chip carrier for the μBC microchip and the fluidic (including fit borings and fit bolts), electrical, and optical connectors. The two different optical bridge connectors for out-of-plane OD monitoring comprise either (1) an LED and photodetector (used for bubble formation monitoring) or (2) two optical fibers.