Fig. 2.

Packaging of the amperometric chip and live-cell experiment procedure. (a) A 3 × 3 mm² CMOS die with post-fabricated Pt electrodes was wire bonded to a chip carrier. Silicone was applied at the surface of the chip carrier insulating the wire bonds and contact pads. This only left the center of the CMOS die exposed where the working electrode array was located. (b) Photograph of IC biosensor package with silicone insulation of wire bonds and contact pads. The area of the IC that was exposed without silicone coverage is indicated by the white dashed line. The amperometric amplifier array shown in Fig. 1a was located at the center of this exposed area. (c) Schematically shown experiment procedure from the cell culture on the chip to the live-cell recording.