Figure 2. TFSCs at different stages of the peel-and-stick process.

(a) As-fabricated TFSCs on the original Ni coated Si/SiO₂ wafer (left). The donor Si/SiO₂ wafer is clean and reusable after the peeling-off step (middle). The TFSCs are held by a temporary transfer holder (right). (b) TFSCs on cell phone (left), business card (middle), and building window (right).