Skip to main content
. 2012 Dec 13;6(4):046502. doi: 10.1063/1.4771691

Figure 2.

Figure 2

SEM images: (a) oblique and (b) cross-sectional view of voids being trapped within rectangular silicon trenches due to non-conformal deposition of glass; (c) cross-section of the same voids after being transformed into cylindrical capillaries Ø800 nm via 2-h anneal at 1000 °C; (d) a close-up shot on a single capillary. (e) A micrograph of the Ø800 nm capillaries from above seen as continuous bright stripes aligned within dark stripes (silicon trenches).