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. 2012 Dec 3;12(12):16571–16590. doi: 10.3390/s121216571

Figure 5.

Figure 5.

Photo-images of the final test structure (a) and respectively details of the PCB-mounted microchip (c,d); SEM images with details of one test electrode (b) and the microchip pads before and after their electrical connection with the PCB circuitry (e,f).