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. 2012 Dec 12;12(12):17007–17022. doi: 10.3390/s121217007

Table 2.

Process parameters for ZnO film deposited by AD method.

Item Data
Starting powder ZnO
Substrate Silicon
Pressure difference between deposition and aerosol chambers 140 (Torr)
Carrier gas Nitrogen
Consumption of carrier gas 3 (L/min)
Orifice size of nozzle 0.4 × 10 (mm × mm)
Substrate temperature 25 (°C)
Deposition area 70 × 70 (mm × mm)
Distance between nozzle and substrate 5 (mm)
Scanning rate 10 (mm/s)
Deposition rate 8.2 (nm/s)